{"id":36762,"date":"2020-01-05T08:00:48","date_gmt":"2020-01-05T07:00:48","guid":{"rendered":"https:\/\/www.expo21xx.com\/news\/?p=36762"},"modified":"2020-01-27T15:11:48","modified_gmt":"2020-01-27T14:11:48","slug":"teledyne-dalsa-linea-hs-16k-multifield-tdi-camera","status":"publish","type":"post","link":"https:\/\/www.expo21xx.com\/news\/teledyne-dalsa-linea-hs-16k-multifield-tdi-camera\/","title":{"rendered":"Teledyne DALSA presents its new Linea HS 16k Multifield TDI camera"},"content":{"rendered":"\n
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Teledyne DALSA\u2019s new 16k multifield camera detects previously undetectable defects at industry\u2019s highest speeds
Photo by Teledyne DALSA<\/i><\/figcaption><\/figure><\/div>\n\n\n\n

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, announces the availability of its newest charge-domain CMOS TDI camera \u2013 the Linea HS 16k Multifield TDI camera. Multifield imaging allows end-users to capture multiple images e.g. brightfield, darkfield, and backlit images simultaneously in a single scan.<\/p>\n\n\n\n

Based on a multi-array TDI sensor architecture, the 16k camera offers 100-kHz x 3 line rate or 5 GPix\/sec data throughput for high-performance imaging applications such as flat panel display, PCB and wafer inspection, life science, aerial imaging and web inspection.<\/p>\n\n\n\n

A first in the industry, the Linea HS 16k Multifield camera uses integrated dichroic filters with minimum spectral crosstalk to spectrally isolate and capture up to three field images e.g. brightfield, darkfield and backlit in a single scan. Combined with advanced lighting, multifield significantly improves tact time and detectability.<\/p>\n\n\n\n

\u201cFor demanding applications like OLED display automatic optical inspection (AOI), end-users currently need to scan multiple times in various lighting conditions to detect defects. With the new Linea HS Multifield camera, customers can complete what used to require three separate passes in a single scan. This significantly boosts the data throughput of an AOI system and with it, improved detectability,\u201d said Xing-Fei He, Senior Product Manager for Teledyne DALSA\u2019s line scan portfolio.<\/p>\n\n\n\n

Combined with Teledyne\u2019s Xtium™2 CLHS series of high-performance frame grabbers, these new products represent a breakthrough in data throughput. Built on field-proven technology, the next generation CLHS fiber optic interface provides reliable and high throughput data transmission. Fiber optic cables lower system costs, offer longer cable lengths (up to 300 m), are immune to electromagnetic radiation, and are ideal for industrial environments. Teledyne DALSA\u2019s Xtium2 family of high-performance frame grabbers feature the PCI Express Gen 3 x8 platform.<\/p>\n\n\n\n

Key Features:<\/p>\n\n\n\n