{"id":37790,"date":"2020-05-01T15:07:31","date_gmt":"2020-05-01T13:07:31","guid":{"rendered":"https:\/\/www.expo21xx.com\/news\/?p=37790"},"modified":"2020-04-28T15:25:49","modified_gmt":"2020-04-28T13:25:49","slug":"teledyne-dalsa-charge-domain-cmos-tdi-cameras-linea-hs-32k-tdi-camera","status":"publish","type":"post","link":"https:\/\/www.expo21xx.com\/news\/teledyne-dalsa-charge-domain-cmos-tdi-cameras-linea-hs-32k-tdi-camera\/","title":{"rendered":"Teledyne DALSA extends its range of charge-domain CMOS TDI cameras with its new Linea HS 32k TDI camera"},"content":{"rendered":"\n
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Patent-pending pixel offset technology outputs 32k resolution for enhanced detectability
Photo by Teledyne DALSA<\/i><\/figcaption><\/figure><\/div>\n\n\n\n

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, announces the release of its newest charge-domain CMOS TDI camera \u2013 the Linea HS 32k TDI camera using patent-pending pixel offset technology.<\/p>\n\n\n\n

\u201cOne of the greatest challenges in machine vision today is to increase resolution while maintaining or even reducing system-level costs. Our new Linea HS 32k TDI camera provides an innovative solution to meet such contradictory requirements. OEMs can readily integrate the new camera into existing systems to achieve much higher performance without needing to change any components,\u201d said Xing-Fei He, Senior Product Manager for Teledyne DALSA\u2019s line scan portfolio.<\/p>\n\n\n\n

The Linea HS 32k uses two 16k\/5\u03bcm TDI arrays with pixel offset. Two 16k\/5\u03bcm images are captured in real time, then reconstructed to achieve a higher resolution image of 32k\/2.5\u03bcm. This upconversion significantly enhances detectability for subpixel defects. One advantage of the patent-pending pixel offset technology is that existing lighting and 16k\/5\u03bcm lenses can be used without sacrifice in responsivity and MTF with a smaller physical pixel size.<\/p>\n\n\n\n

Combined with Teledyne\u2019s Xtium™2 CLHS series of high-performance frame grabbers, these new products represent a breakthrough in data throughput. Built on field-proven technology, the next generation CLHS fiber optic interface provides reliable and high throughput data transmission. Fiber optic cables lower system costs, offer longer cable lengths (up to 300 m), are immune to electromagnetic radiation in industrial environments. Teledyne DALSA\u2019s Xtium2 family of high-performance frame grabbers feature the PCI Express Gen 3.0 x8 platform.<\/p>\n\n\n\n

Key Features:<\/p>\n\n\n\n