Molex offers a wide variety of wire-to-board connector solutions that fit applications requiring high-power solutions or microminiature options.

Our wire-to-wire options include the versatile SL™ connectors, power solutions such as Mini-Fit®, and a variety of sealed connector solutions.

Molex offers a wide variety of Board-to-Board Connectors for high-speed, high-density, and high-power applications. Examples include stacking, mezzanine, coplanar, and orthogonal connectors.

Achieve power delivery and power distribution with Molex’s vast array of power connectors
Molex is uniquely equipped to provide power delivery and power distribution in wire-to-wire, wire-to-board and board-to-board configurations. Molex’s wide selection of power connectors range from the versatile EXTreme Power™ connectors to the popular and proven Mini-Fit®, Micro Fit 3.0™ and KK connectors. These off-the-shelf connectors can be modified, customized or adapted to meet virtually any application requirement.

Molex is a leader through active participation in committees and working groups to develop and specify high-performance I/Os throughout a wide variety of industries. These include the SAS, SATA, PCIe, HSSG, FIBRE CHANNEL, INFINIBAND, IEC, CEA, DDWG, IEEE, VESA, USB and many more.
 

Only Molex offers a variety of backplane/midplane solutions to meet the demand for increased network bandwidth and advanced technology. Each solution is designed for high performance, increased density and optimal data rates.

Our FFC-FPC connectors are available in a variety of fine-pitch styles including our BackFlip™ and Easy-On™ actuators.

Molex's broad range of Modular Jacks and Plugs, with more than 1000 different parts, provides versatile solutions to meet today's increasing demand for information flow with greater bandwidth requirements. Our extensive breadth of products offer exceptional performance and reliability for voice, data and high-speed networking applications and are the ideal solution for consumer, office, medical, commercial and industrial applications.

Includes ring and spade terminals, terminal blocks, heat-sealable terminals, splices, wire management, IDC, magnet wire, quick disconnects, snap plugs, lugs, and other solderless solutions.

Molex offers a variety of terminal blocks in wire-to-board and wire-to-wire configurations to support applications ranging from HVAC equipment, power supplies and data acquisition to inverters, motion and process controls and factory and building automation.

Molex is a leading supplier of a wide variety of standard coaxial connector products, cable assemblies and custom solutions for today's most common applications, covering frequencies from DC to 40 GHz. Markets supported include military, automotive, medical, instrumentation, telecom and wireless. We can provide interconnect solutions to support your application requirements. Our manufacturing facilities in Taiwan and Indiana produce coaxial connectors and cable assemblies

Molex's extensive sealed connector product offering, provides ideal interconnect solutions for harsh environments. Our sealed connectors can be found on factory floors, in heavy-duty equipment like tractors, trucks and buses, and also in non-automotive transportation applications like boats, RVs and ATVs.

If you do not find what you want in our extensive list of standard cable assemblies, please contact Molex for custom cable assemblies. Our flexible design and manufacturing capabilities allows us to better provide custom cable solutions for numerous applications.

Molex offers high-end harness designs specializing in high-signal, high-density and high-speed applications for fully integrated solutions in all industries from automotive to telecommunications.

Molex offers a wide range of memory connectors that are conformed to the JEDEC industry standards for DIMM (Dual In-line Memory Modules) and SIMM (Single In-line Memory Modules) as well as custom memory modules for Notebook, Desktop, Workstation, Server, Storage and Communication applications.

Molex offers a variety of Memory Card Connector styles including microSD, SD card, SIM, MMC, Memory Stick, and other popular formats.

These high-density CPU sockets feature low profile and proven Ball Grid Array (BGA) soldering technology.

Molex is a world leader in the design, development and manufacture of custom antennas and assemblies for wireless and mobile applications; particularly for 3D antennas produced by LDS and two-shot technology, specializing in customized designs with a focus on small multiband antennas (including Pentaband and 4G LTE) and complementary (NFC, internal FM, BT/GPS, WLAN) antennas.

Molex's Laser Direct Structuring (LDS) Technology offers flexibility and geometric 3D design freedom in making antenna products beyond the previously often used flex-antenna technologies, which only allow a maximum 2.5 D design of the antenna radiator. Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a molded antenna carrier or even directly onto the device structure. Cosmetic surfaces of the antenna can also be achieved by using a subsequent spray painting process.

Based on diverse manufacturing and RF technologies, Molex standard antennas offer high performance and ease of integration for demanding wireless applications spanning the industrial, consumer, medical and automotive markets.
The global market is trending toward wireless applications. On the industrial side, global smart grid deployments are leading in M2M (machine-to-machine) wireless communication. In consumer markets, wireless internet television and audio dominate. Many wireless devices are better served with a standard antenna rather than a customized one.

Molex combines advanced MID technology with LDS antenna expertise to deliver integrated fine-pitch 3D circuitry with shielding in a single molded device for high-density medical devices and other applications.
Molex has developed an innovative Molded Interconnect Device/Laser Direct Structuring (MID/LDS) capability under MediSpec™ that will allow medical device designers to integrate highly complex electrical and mechanical features into highly compact applications which existing flat 2D technologies cannot accomplish.

Molex is a global leader in interconnect solutions, as well as custom user-interfaces, membrane switches and flex circuits. Our manufacturing capabilities are strategically placed in the United States, Mexico and China, and include automated processes such as screen-printing, surface-mount component bonding, die cutting and tactile element (snap dome) placement. Secondary processes include final assembly, 100% electrical inspection/testing and packaging. A full-service prototype lab is present in each location to produce designs and qualify products prior to final tooling.

Molex copper flex circuit assemblies provide solutions to your packaging problems. From high-speed signals to power requirements, flex can provide solutions where standard rigid boards or cables cannot. In tight spaces, harsh environments or where the ability to bend or flex the substrate is required, flex offers the only solution that can provide a unitized approach to packaging problems. No separate boards, connectors and cable. Flex provides that total solution with power and signal all in one unit and at a low total applied cost.

Molex is the expert when it comes to interconnect PCB assembly solutions. We offer clean sheet mechanical and electrical design, development and test support, including modeling and empirical testing. Our engineering teams work with you to ensure a design that meets your needs. Whether it is a small interconnect board or a complete module, we can offer global manufacturing, material sourcing, tooling and testing.

• DeviceNet Network Interface Cards
• Brad® Diagnostics and Tools
• SST™ DN4 DeviceNet* Network Interface Cards and USB Interface Module
• Brad® CIP Safety Software Kits (Stacks)
• PROFINET Protocol Stacks (SDKs)
• PROFINET* Solutions
• Brad® SST Communication Modules for Rockwell Automation PAC / PLC Controllers
• Brad® HarshIO IP67 Modules
• Brad® EtherNet/IP Solutions
• Brad® Direct-Link® Harsh-Duty Switches

• Brad® Micro-Change® M12 Circular Hybrid Technology (CHT) Connector
• Brad® Circular Ruggedized Push/Pull Connector (CRP2)
• Brad® Foundation FieldBus Cordsets and Receptacles
• Brad® M23 Connectivity
• Brad® Micro-Change® (M12) Connectors
• Brad® Mini-Change® Products
• Brad® Nano-Change® (M8) Products
• Brad® Quick-Change® Connectors
• Brad® Ultra-Lock® Connection System
• Brad® mPm® DIN Valve Connectors
• Brad® Micro-Change® Heavy-Duty (M12) Connectors

Brad® Power solutions replace machine hard wiring with modular, quick-connect systems comprised of crush resistant, pre-wired cordsets and factory-molded connectors. The result is a robust, scalable and easy-to-install power distribution system that does not require the specialized tools and labor typically associated with traditional conduit or raceway installations.
Brad Power wiring systems' modular components make installation faster, easier and more reliable. Where multiple machines are involved, assembling the systems is consistent and repeatable.

• Brad® DeviceNet* Solutions
• Brad® Ethernet Solutions
• Brad® PROFIBUS Solutions

Helieon® Sustainable Light Modules - the remarkably simple solution that provides easy interchangeability, upgradeability and replacement.

Molex’s LED Array Holder, ideal for OEM light-fixture manufacturers, simplifies the LED installation process for Bridgelux energy-efficient ES and RS Arrays and reduces installation time with compression contacts that eliminate hand soldering.

Molex’s LED Array Holder, ideal for OEM light-fixture manufacturers, simplifies the LED installation process for Citizen energy-efficient CL-L330 and CL-L340 Arrays and reduces installation time with compression contacts that eliminate hand soldering

Molex’s LED Array Holder, ideal for OEM light-fixture manufacturers, simplifies the LED installation process for Cree* XLamp† energy-efficient arrays and reduces installation time with compression contacts that eliminate hand soldering

LED Array Holder, ideal for OEM light-fixture manufacturers, simplifies the LED installation process for the Illumitex energy-efficient Aduro / Surexi Arrays and reduces installation time with compression contacts that eliminate hand soldering.

Molex’s heat sinks for LED array holders provide fast, effective cooling via a highly-efficient heat-dissipating design, ensuring the maximum life of LED arrays.

Molex leverages its combined Light-Emitting Diode (LED) and Printed Circuit Assembly design and manufacturing expertise to provide dependable and efficient custom-lighting solutions seamlessly for computing devices across all industries.