Our systems and solutions are capable of submicron accuracy and repeatability to meet your challenging GRR standards

We design and develop advanced, automated, non-contact metrology solutions that help ensure superior quality and maximize throughput.

• Non-Contact Inspections
  Using our proprietary lighting, strobe controllers, and sequencing software, we routinely deliver systems capable of inspecting parts traveling at 250 millimeters per second with 2μm accuracy and 10% GRR. Our solutions sort and bin parts based on measurement results, and include non-marring part handling capabilities for delicate parts, such as ESD devices and medical implants.
• Multi-Sensor 3D Data Measurements
  We have deployed systems with more than 15 sensors that rapidly gather both 2D and 3D data to enable low GRR, perform simultaneous measurements, and decrease cost and footprint.
• Bore & Thread Inspections
  Our systems provide advanced measurement capabilities to inspect bores and internal features critical to the aerospace, automotive, medical device, and oil and gas industries.
• In-Situ Measurements
  We have experience measuring parts as they are being manufactured, enabling process feedback for high-yield, quality production.

Our custom, high-speed, automated inspection systems identify and classify micron-level defects and surface flaws across a wide range of materials, including transparent and translucent materials

We design and develop solutions that help optimize upstream processes, improve product quality, and avoid costly device recalls before products reach consumers.

• Package Seal Inspection
  Our systems perform defect inspection and classification for Class 3 medical device seals and labels across different material types, such as Poly-Poly and Poly-Tyvek. We inspect packages moving at 250 millimeters per second with 11 pixel² resolution machine vision cameras, custom strobe lighting, and deep learning software to capture 50μm diameter defects.
• Label Inspection
  We design and build ultra-precise systems with a combination of high-performance machine vision, multiple robots, and sophisticated custom software to print, place, and inspect labels with better than 70μm accuracy every 7.5 seconds.
• Component Verification
  Using multi-sensor vision systems and AI-driven machine learning software, our high-speed solutions inspect complex final assemblies to verify that all components have been properly included and assembled. Our smart systems are trained to recognize correct assemblies and robustly classify defects based on sample images.
• Part Defects
  Our defect detection systems perform smart inspection of consumer electronics and medical devices in seconds using automatic orientation to precisely place parts without marring part surfaces. Advanced machine vision and custom strobe lighting is integrated with deep learning algorithms to detect micron-level cosmetic defects on glossy, shiny, and rough surfaces.
• Classify & Bin
  Not only can we sort and bin both good and bad products, but our systems feature deep learning software and advanced machine vision capable of classifying defects to sort products based on the type of defect.

We specialize in high-speed, precision assembly and test automation across various manufacturing applications

We are recognized in the industry for delivering the most innovative solutions, incorporating process elements such as precision dispense, welding, and force sensing.​ All of our systems are characterized by precision and speed to enable high throughput and product quality.

• Vision Feedback
  We use machine vision feedback systems to precisely orient components within single-digit microns and microradians. Through-beam transmitters and receivers ensure chucks are clear before loading new parts, identification lasers confirm parts remain stable on conveyors, and barcode readers scan part IDs for recipe-driven process customization.
• Precision Dispense
  We excel at precision dispense applications. Vision systems locate and align multiple components up to 5μm, providing vision feedback for accuracy and repeatability. Multi-head glue dispense systems apply 0.034 microliters of adhesive while vision and confocal systems perform in-situ volume detection and final gap measurements to confirm part quality.
• Ultrasonic Welding
  We integrate precision touch probes capable of 12.7μm resolution into ultrasonic weld heads to sample points across seams prior to welding. Our systems accurately map lapped seam profiles across materials with nonuniform thickness variations, automatically adjusting and calibrating the height as needed to ensure uniformity.
• Plasma Surface Treatment
  Using a multi-axis ball screw precision gantry, single- and multi-head dispense systems, UV curing, and laser ablation, our systems precisely dispense nano liters of material as dots, lines, or irregular shapes on edges of connectors without weeping over edges.
• Laser Processing
  We use laser processing in many applications, including etching, marking, and ablation. Our laser ablation systems precisely remove surface coatings from specific areas of materials, while our etching systems integrate advanced robotics and machine vision to orient, laser engrave, and assemble components into final assemblies.
• Force Sensing
  We use three-axis force sensors to guide advanced robotics when applying pressure in bonding applications or removing masking layers, and torque sensors to drive screws. These technologies help with delicate material handling.
• In-Process Component Weighing
  Our automation systems can include dead nest weighing stations where final products are weighed to meet predefined client standards. By transmitting accurate weight data through networks at high speeds, our systems ensure maximum throughput and high quality.
• Excise & Attach
  We have designed and built excise and attach systems that die-cut and attach nozzles with 10μm accuracy to semiconductor wafers using multiple 150μm adhesive dots with 20μm accuracy. Our systems are also capable of rapidly cutting and inserting 5mil wires into 10mil diameter holes. These flexible systems utilize vision technologies to locate components, multifunctional grippers to interface with custom load cells to transfer components bewteen processes, and recipe-driven custom control software.
• Lamination
  Our lamination systems employ multiple subsystems including label applicators, laminating nests, laminating rollers, input & output cassettes, pick & place actuators, and reject handling systems. Our systems have been deployed in semiconductor applications and fan-out technology enablement.
• Etching
  We specialize in electroprocessing medical implant devices to anodize interior surfaces for color coding, prepare surfaces for final coating, or improve porosity for bonding.
• Swaging
  Our high-speed assembly systems orient, assemble, swage, and inspect components at a rate of 1.25 seconds per assembly. Using custom control software, the automated processes are recipe driven based on client and product requirements, sorting and binning final products onto packaging lines and reject bins.

Quality. Precision. Innovation.