• Integrated 3D Sensor C6 Series
• Price-performance ratio: Cost-effective 3D sensor for demanding applications
• Software standards for easy integrations: GigE Vision, GenICam and third-party software support
• Cross-industry application area: Ideal for the food industry, logistics and robot vision

The ECS series (Eco Compact Sensor) represents the latest innovation in 3D sensor technology, characterized by its economy and performance. These sensors are particularly cost-effective, thanks to the use of lower cost optics and sensors and the support of class 2M lasers with a wavelength of 660nm, while offering reliable performance at an affordable price. Designed for standard applications in the food, logistics and robot vision industries where high-end technology is not required, ECS sensors deliver fast and accurate data acquisition with an output of 2048 and 4096 points per profile and speeds up to 25 kHz. They offer various field of views and a compact design for easy integration as well as fast software connectivity through GigE-Vision / GenICam, making them ideal for cost and efficiency conscious projects.

• Integrated 3D Sensor C6 Series
• Factory calibrated 3D sensors
• Large selection of models with X-FOV 7 – 1290 mm
• Four different sensor resolutions available (1280, 2040, 3070, 4090)
• High industrial protection class IP67
• Available with different laser configurations

The CS sensor series sets new standards in 3D laser triangulation technology with resolutions of up to 4,096 pixels, profile frequencies of up to 204 kHz and fields of view of 7 to 1300 mm. These robust sensors with protection class IP67 and M12 connections for a reliable power supply and data transmission are available in various housing sizes. Integration is straightforward and takes place via standard interfaces such as Gigabit Ethernet or GenICam. The CS series thus offers a powerful, maintenance-free solution for OEM customers and end users in demanding industrial environments.

• Unique 3D scan results without occlusion due to dual-head option and extremely high resolution
• High precision and repeatability thanks to high-quality laser line projection
• Unrivaled optical resolution for electronic inspection (e.g. BGA inspection) with a field of view of up to 53 mm
• Highest inspection speed available with 3070 WARP sensor

With the new 3D sensor from the XCS series, AT – Automation Technology is launching a product that is particularly suitable for high-performance applications in the electronics industry thanks to its enormous precision and extreme speed. The sensor is characterized by an optimized laser with homogeneous thickness along the laser line, which guarantees precise detection of even the smallest structures. This enables high-precision inspection applications with high repeatability, which is ideal for the inspection of ball grid arrays (BGAs), among other things. The innovative clean beam function protects the laser from external interference and ensures a uniform intensity distribution, which further increases reliability. The sensor’s dual-head option eliminates occlusions and achieves profile speeds of up to 140 kHz with the 3070 WARP version, speeding up data analysis and increasing efficiency.

• Integrated 3D Sensor C6 Series
• Modular sensor concept for individual solutions
• Flexibly adaptable to customer requirements
• No extra costs
• No long delivery times

The Modular 3D Compact Sensor (MCS) from AT – Automation Technology is revolutionizing 3D image processing with its unique modularity, flexibility and high performance. This innovative system allows individual configuration in terms of scan width, measurement accuracy, speed, triangulation angle and working distance to perfectly match the needs of specific applications. With an unprecedented profile speed of 200 kHz and a resolution of 4096 points per profile, the MCS sets technological standards. It overcomes traditional hurdles such as high NRE costs and long development times by combining the reliability of a series product with the flexibility of a customized solution, without additional costs or minimum order quantities.

• STEC Targets
• CS I/O Kit
• GigE Ethernet cable
• I/O cable

Designed for users who want to freely configure the use of the 3D sensor and choose components such as lasers or lenses themselves.

• Compatible with custom components
• Ideal for custom application design
• Optimal for complex multi-sensor applications
• Perfect 3D imaging through integrated Scheimpflug arrangement

The AT SolutionPackage bundles everything needed for setting up and configuring the AT sensor or camera, as well as for implementing the corresponding application. It includes:

• Software tools for establishing connections, sensor setup, and image data visualization
• Powerful cxSDK tool with programming interfaces for C, C++, and Python
• Easy evaluation of metrology applications with the MetrologyPackage