• LASER & OPTICS 21XX

Navigation : EXPO21XX > LASER & OPTICS 21XX > H17: Optical Components > Corning Laser Technologies
Videos
Loading the player ...
  • Offer Profile
  • Corning Laser Technologies is on the forefront of laser innovation, offering laser systems that have a distinct advantage over conventional glass cutting processes. Corning offers laser glass processing systems with the ability to cut Corning® Gorilla® Glass, chemically strengthened glass as well as un-strengthened glass and other brittle materials.

    Corning Laser Technologies material science and optic capabilities add unique advantages to the laser glass cutting process. It offers not only distinct advantages over conventional cutting processes, but also over other laser cutting systems.

    Using ultra-short laser pulses, the material is cut by material disassociation rather than ablation. The result is a very low surface roughness, increased as-cut bend strength and faster throughput.

Product Portfolio
  • Corning Laser Technologies

  • Corning Laser Technologies is on the forefront of laser innovation, offering laser systems that have a distinct advantage over conventional glass cutting processes. Corning Laser Technologies offers three glass processing systems, each offering different size substrate capabilities, all offering glass cutting and drilling capability. Each system has the ability to cut strengthened and unstrengthened glass as well as other brittle materials. These systems cut the material by disassociation rather than ablation which provide numerous benefits:

    Smooth Edges – The ‘as-cut’ edge roughness may eliminate or reduce post-processing time and cost
    High Break Strength – The ‘as-cut’ edge demonstrates superior break strength over other laser and conventional cutting processes as measured by 3 & 4pt bend tests.
    Multi-Layer Stacks – The systems can cut assembled functional stacks with and without air gaps, cutting depths can be adjusted.
      • Superior Technology

      • Corning Laser Technologies' material science and optic capabilities add unique advantages to the laser glass cutting process. It offers not only distinct advantages over conventional cutting processes, but also over other laser cutting systems. Using ultra-short laser pulses, the material is cut by material disassociation rather than ablation. The result is a very low surface roughness, increased as-cut bend strength and faster throughput. The Corning laser process enables cutting fully strengthened glass, un-strengthened glass, as well as other transparent glass and crystalline materials.

      • Unique Benefits

        • Cuts curved, straight, perpendicular, and angled lines
        • Cuts extremely fast to maximize throughput
        • Significantly reduces micro-cracks and chipping
        • Near net shape cutting
        • Minimal particle generation (clean room compatible processing)
        • Superior edge quality
        • Cuts functional multi-layer stacks
        • Eliminates fluids and tooling required in traditional processing methods
      • The laser tool for your creativity

      • You have the creativity, we have the tools. With Corning Laser Technologies' advanced glass cutting solutions you can start to literally think out of the box: Complex shapes – greater freedom for your design ideas. Now you can design speciality glass like never before. Cut holes, radius form factors, complex geometries, vias, blind holes, slots and more.

        • Adapt the shape of touch screens to your design, not vice versa.
        • Use Corning® Gorilla® Glass instead of conventional soda-lime to save weight.
        • Add high value glass parts for a premium feel of your products.
        • Integrate buttons or loudspeakers into the glass panel.
        • Use your creative imagination to develop innovative applications.
    • Corning Laser Technologies Solutions

        • Cutting

        • Laser Cutting Display Glass

          Corning Laser Technologies' laser cutting processes employ ultra-short laser pulses (in the picosecond range) that cut the glass utilizing nonlinear processes. This ensures a low cut face roughness, increased cut bend strength, and a higher throughput. Corning Laser Technologies laser glass cutting thus enables a higher quality, output and yield in the high volume production of touchscreen displays for smart phones, tablet PCs and other consumer products.

          Even without post processing, the edge roughness achieved by our cutting process is less than 2µm. In most cases the glass can be used ‘as cut’, saving on post-processing time and cost. Glass pieces cut with Corning Laser Technologies' laser process have superior break strength behavior, compared to items singulated by other laser and conventional glass cutting processes.
        • Processing and Micro Materials Processing

        • Processing of Strengthened Glass and Glass Substrates

          Corning Laser Technologies offers unique laser processing capabilities for demanding applications such as cutting of cover glasses for mobile phones and tablet PCs, displays, camera protection glasses, and coated substrates. A specially tuned laser is used to perforate brittle material using a nonlinear optical process. The technology can be used to cut both unstrengthened and strengthened glass, as well as other brittle materials.

          Furthermore, the systems are well prepared for cutting, drilling, structuring, welding and laser marking /identification (DMC, OCR) as well as processing of thin-film, ceramics, semi-conductor materials, OLED, PET, metals and non-metals. 

        • Drilling

        • Laser Drilling Display Glass

          Our drilling processes employ ultra-short laser pulses (in the picosecond range) that remove glass through nonlinear effects. The technology can be used to drill glass with extremely low wall taper and little to no micro cracks. Beyond drilling, any geometry can be cut, including cut-outs such as circles or slots, closed-form and radius form factors.

          Drilling of Brittle Materials
          Corning Laser Technologies' laser drilling works for both unstrengthened and strengthened glass, as well as other brittle materials. The process is clean room compatible, because it generates close to zero material loss and debris.
        • Customized Automation

          • Highly stable and reliable machine design proven in high volume manufacturing (HVM) with heavy duty components built in.
          • Highest quality optical components, software and controls (PLC, in-house software developments MES/CIM).
          • In-house process development and tailored solutions for full automation are perfectly rounding off the product portfolio, providing a one-stop-shopping at Corning.
          • Corning Laser Technologies offers dedicated substrate and parts handling for loading and unloading.
          • Also supporting automation concepts for optimized yield and throughput for 24/7.
        • Applications

        • We Can Fit Your Needs

          Corning Laser Technologies offers advanced laser machining systems for glass processing of both strengthened and unstrengthened glass as well as other brittle materials. The application lab, located in Germany can help tailor a solution to your requirements.

          Cutting of Glass Substrates:

          • Display glass
          • Coated substrates
          • Sandwich applications
          • Cutting thin substrates

          Separation of Strengthened Glass:

          • Cover glass for mobile phones
          • Cover glass for tablets and PCs
          • Camera protection glass

          Drilling in Glass Substrates:

          • Mobile device (camera aperture, home button, speaker etc.)
          • Welding and Laser Marking /Identification
          • DMC
          • OCR

          Processing

          • Thin-film
          • Ceramics
          • semi-conductor materials
          • OLED, PET
          • Metals and non-metals.
      • Platforms and Workstations

      • The Corning Laser Technologies systems are developed in close cooperation with the specialists at Corning, the world’s leading innovators in specialty glass. This material science expertise adds unique advantages to the laser glass cutting process.
          • CLT 500X

          • The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries. The machine’s axes are driven by linear motors.  This technology enables high processing speeds while maintaining very good dynamic stability in the axes. The accuracy and precision of the system is due to the high-resolution glass scales used in each axis as measuring components in the motion control system. The CLT 500X is built around a solid granite platform, allowing a high degree of overall accuracy for the machine.

            Typical Functions of the CLT 500X

            Glass processing applications:

            • Cutting
            • Drilling
            • Processing

             

          • CLT 45G NX

          • A multipurpose high-precision laser processing tool.

            The CLT 45G NX laser tool is designed for 24/7 production in an industrial environment. It´s versatility also makes it an ideal R&D tool.
            The Corning Laser Technologies systems are developed in close cooperation with the specialists at Corning, the world’s leading innovators in specialty glass.

            Key Benefits

            • Cuts holes, radius form factors, complex geometries, vias, blind holes, slots and more
            • Cuts functional multi-layer stacks
            • Cuts glass from <50μm up to 3.5mm thickness
            • Eliminates fluids and tooling required in traditional processing methods

            Applications

            Advanced multi purpose laser machining systems:
            Processing Glass Substrates

            • Display technologies
            • Coated substrates
            • Sandwich applications
            • Cutting “thin” substrates
            • Strengthened Glass
            • Cover glasses of mobile devices
            • Cover glasses of tablet PC’s
            • Camera protection glasses
            • Drilling of Through Holes in Glass Substrates
            • Mobile Devices (camera aperture, home button, loudspeaker, etc.)
            • Electronic components
            • Tablet PC’s and computers

            Micro Materials Processing

            • Cutting and drilling of OLED, PI, Wafer, Ceramic, Plastic, etc.
          • CLT 66G

          • The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6. The machine’s axes are driven by linear motors. This technology enables high processing speeds while maintaining very good dynamic stability in the axes.  The accuracy and precision of the system is due to the high-resolution glass scales used in each axis as measuring components in the motion control system. The CLT 66G is built around a solid granite platform, allowing a high degree of overall accuracy for the machine.

            Typical functions of the CLT 66G

            • Cover glass cutting
            • Cover glass drilling
          • CLT 80G

          • High-precision laser glass processing for up to Gen 8

            The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm. The Corning Laser Technologies systems are developed in close cooperation with the speciality glass experts at Corning. Their material science and optics knowledge adds unique advantages to this laser glass cutting process.
            Using ultra-short laser pulses, the CLT 80G cuts by material disassociation rather than ablation. The result is a very low surface roughness, increased as-cut edge strength and faster throughput. The Corning Laser Technologies process enables cutting fully strengthened glass, Corning® Gorilla® glass, un-strengthened glass, as well as other transparent glass and crystalline materials.

            Key Benefits

            • Free-form, near net-shape cutting at up to 1m/s
            • Cuts: curved, straight, perpendicular and angled lines as well as holes and slots
            • Cuts glass from <50μm up to 6 mm in thickness
            • Automatic/touch-free separation process
            • Eliminates fluids and tooling required in traditional processing methods