Our HTPA series consists of 2D arrays with different pixel counts:
These discrete sensors can be configured with different kinds of lenses, resulting in a variety of field of views (FOV). Furthermore, we do customer specific optics on request. The small dimensions and the very low power consumption makes the HTPA series very attractive for handhelds and battery powered solutions. The sensor chip contains next to the sensor elements integrated low noise chopper amplifiers and low pass filters + temperature reference, voltage reference and an analogous output. Some types also provide an digital output, powered by their integrated 12bit ADC.
Heimann Sensor offers calibrated HTPA-Modules for thermal imaging. Those modules can be configured with several lenses for different applications. As Interface you can choose between Ethernet (UDP) or a PoE Module. It is possible to get a temperature or voltage stream, or to get single frames. Furthermore, these data can be visualized by the Heimann Sensor ArraySoft GUI.
We offer thermopile array application sets and modules as a fast and easy imaging solution on your PC. The connection can be done via Ethernet. The sets are delivered with a graphical user interface for visualisation. Our fully monolithic arrays are the pathfinders to application fields like thermal imaging, industrial temperature monitoring, hot spot detection, fire- or person detection. Monolithic means micro-machined sensor elements combined with an application specific integrated circuit. So it is possible to use very small housings like TO8 (80x64) or even smaller like TO39 (32x32, 16x16). These low- cost camera- alike sensors can be inserted in small systems and occupy little space.
Our fully monolithic arrays are the pathfinders to application fields like thermal imaging, fire-, hotspot- or person detection. These low- cost camera-alike sensors can be inserted in small systems and occupy little space. Therefore, it is possible to use very small housings like TO-39. Due to the significant price drop compared to micro bolometers these small imaging systems open completely new application fields.
Mems ServiceWe offer bulk micromachining and surface micromachining for silicon substrates. These processes are used to produce three- dimensional-structures like micro-electromechanical systems (MEMS) or micromachinery.
With Double-sided lithography it is possible to process both sides of wafer with exact registration of the structures on both sides.
Through Silicon Via
With this you can make an electrical connection between frontside CMOS structures and backside structures. In the very near future we can provide this service to you.