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  • Offer Profile
  • Posalux is a swiss company specialized in micro machining with a focus on highly demanding markets in need of high-tech equipment. Leading solution provider in micro technologies for mass production
Product Portfolio
  • EDM

      • Microfor HP4 EDM

      • Designed for Mass Production
        • High productivity
        • High positioning accuracy
        • Process stability
        • Easy machine maintenance
        • Multi spindle machine available
        • Compact water deionization system
        • Siemens 840D SL

        Micro-EDM
        • Based on the electro erosion principle the integrated micro-EDM generator allows machining with shorter cycle times implying up to 30 % more productivity.
        • Micro-EDM generator interface with high-speed mode and direct communication.

        Innovation
        • Surface finish Ra < 0.3 μm.
        • Elimination of micro-vibrations by separation of filtration tank from machine frame.
        • Screen integrated on camera and automatic positioning program facilitate setting of the electrode and the needle of the part fixture
        • Decrease of leak check time by 50 %.
        • New interface HMI:
        • Real time monitoring of process parameters
        • Storage and visualization of erosion time and electrode wear
      • EDM HFP Microfor EDM

      • Designed for flexible small batch production
        • High productivity
        • High positioning accuracy
        • Process stability
        • Easy machine maintenance
        • Compact water deionization system
        • Siemens 840D SL

        Micro-EDM
        • Based on the electro erosion principle the integrated micro-EDM generator allows machining with shorter cycle times implying up to 30 % more productivity.
        • Micro-EDM generator interface with high-speed mode and direct communication.

        Innovation
        • Surface finish Ra < 0.3 μm.
        • Elimination of micro-vibrations by separation of filtration tank from machine frame.
        • Screen integrated on camera and automatic positioning program facilitate setting of the electrode and the needle of the part fixture
        • Decrease of leak check time by 50 %.
        • New interface HMI:
        • Real time monitoring of process parameters
        • More flexible programming possibilities
        • Storage and visualization of erosion time and electrode wear

         
    • SACE

          • SACE – Spark Assisted Chemical Engraving

          • Spark Assisted Chemical Engraving - SACE
            • Mass and flexible production: prototyping small series, batch '1 size'.
            • Modular concept with various number of possible configurations: 1 to 4 heads machine configuration.
            • High positioning accuracy and process stability.
            • Clean-room compatible.
            • Mask less process.
            • Low tooling costs.
            • Surface strengthening and texturing.
            • 2,5 D machining.
            • Burr and micro-crack free machining.

            Machining specifications

            • 0.05 to 1.5 mm3/min/tool depending on the quality required.
            • Multitool technology : 1 to 36 tools possible per module
      • FEMTO LASER

          • FEMTO LASER 3-axis machine

          •  Advanced µ-machining solutions for high-tech production
            Characteristics :
            • FEMTO source down to 200 fs
            • Light wave length : nIR (1030 nm)
            • 5-axis precession head
            • Vision system, beam attenuator, shutter, beam analyser, power recorder
            • Machine class 1 (I), FEMTO-LASER class 4 (IV)
            • Dedicated multifunctional software
            • Siemens 840 D SL, safety integrated CNC
            • Machine at +/- 1°C, operated in over-pressure


            Technical Highlights :

            • Focal length measurement
            • Interchangeable clamping devices
            • High precision positioning X-Y table (300×300 mm)
            • Camera for repositioning check
            • Dust extraction
            • MONO configuration (prototypes and mass production one head machine)
          • FEMTO LASER 5-axis machine

          •   Advanced µ-machining solutions for high-tech production
            Characteristics :
            • FEMTO source down to 200 fs
            • Various harmonics available (wave length): nIR and green
            • 5-axis precession head
            • Vision system, beam attenuator, shutter, beam analyser, power recorder
            • Linear axis system allowing high dynamic and accurate motions
            • Machine class 1 (I), FEMTO-LASER class 4 (IV)
            • Siemens 840 D SL, safety integrated CNC
            • Machine at +/- 1°C, operated in over-pressure


            Technical Highlights :
            • Focal length measurement
            • Automatic loading / unloading solutions
            • Camera for positioning
            • Dust extraction
            • TWIN configuration (hidden time data collection during drilling)
            • COMBI configuration (laser drilling and mechanical milling combined solutions)
        • MECHANICAL Micro-Machining

            • Milling

            • Hightech micro-milling technology
              Designed for Mass Production
              • Dedicated to a milling process in hard materials up to 67 HRC / 900 HV
              • Mass production one spindle milling machine
              • Vibration reduced process due to innovative spindle design
              • Dry machining technology
              • Suction system for extracting waste chips
              • Designed for cell integration

              Milling Spindle
              • Air bearing spindle
              • Rotation up to 60'000 rpm (optional 100'000 rpm)
              • Increased tool life (up to 5'000 holes) due to innovative spindle design
              • Oil free and grease free operation
              • Tool holder HSK E25 balance quality G 0.1

              Micro-Milling
              • Milling Ø 0.1-2 mm (typical for step hole 0.3-0.9 mm)
              • Accuracy for milling X/Y/Z +/- 20 μm
              • Accuracy for drilling X/Y/Z +/- 10 μm
              • Cycle time per workpiece (8 holes) < 11 s (e.g. for step holes milling in 1.4112 , 64 HRC, dia. 500 μm, thickness 0.3 mm)
              • Depth control +/- 10 µm
              • Integrated deburring station
            • ULTRASPEED MONO CW

            • Hightech micro-drilling and routing.

              Combi technology with high accuracy, productivity and reliability

              • High productivity up to 500 holes/min (e.g. in Brass, diameter 500μm, depth 1200μm)
              • Process stability (running time > 20 hours)
              • Easy machine maintainability
              • Routing and drilling process
              • Palletization of template up to 250 plates per loading or 2 sheets with a plate size of 560×350 mm
              • Workpiece format Area 710×560 mm
              • High speed air bearing spindle up to 200'000 rpm (vibration reduction)
              • High speed ball bearing spindle up to 60'000 rpm (high stiffness for routing)
              • Cooling process (depending on application):
              • by cold air nozzle or lubrication by microjet (mixture air-oil)
              • Dry machining technology
              • Pressure pad with suction for extracting waste chips
          • Technologies

              • EDM micromachining with V7 technology

              • Posalux micro-EDM solutions for all high-end productive micro-drilling needs, based on more than 20 years of experience in demanding automotive applications.

                Function
                The process is based on the electro-erosion principle. Material is removed from the workpiece by a series of rapidly recurring current discharges between two electrodes, separated by a dielectric liquid and subject to an electric voltage. One of the electrodes is called the tool-electrode, or simply the “tool” or “electrode,” while the other is called the workpiece-electrode, or “workpiece.” The process depends upon the tool and workpiece not making actual contact.

                In order to machine high quality micro holes the Posalux EDM machines have a tilting head with deformation by pressure that allows to control the diameter of the hole, resulting in a run-out of the tool electrode. The electrode turns with a decentering, giving two different gaps, one where sparks erode the material and another, bigger one, allowing a better flushing of eroded materials. In combination with CNC driven axis and a high-speed interface to communicate with the micro EDM generator, perfect micro holes are the result.

                μ-EDM
                The use of the latest, integrated SARIX μ-EDM technology allows machining with high quality and efficiency, meeting the needs of mass production scenarios.

                Applications
                Automotive – Spray hole drilling in Diesel and gasoline injection nozzle.

                Microdrilling of valve plates.

                Electrode guiding system
                The integrated advanced electrode guiding system precisely feeds the smallest electrode available on the market, down to 35 μm.

                Quality and expertise
                • Flow check system to characterize repeatability and stability
                • Optical and fiber non-destructive measurements to control hole diameter, shape and position
                • Scanning Electron Microscope (SEM)
                  • SACE – Spark Assisted Chemical Engraving

                  • SACE – Spark Assisted Chemical Engraving – is an innovative solution to machine glass substrates without material alteration, keeping transparency properties with high accuracy.

                    Principle / Function

                    Spark Assisted Chemical Engraving (SACE) is a hybrid technology, that combines chemical etching accelerated by thermal process. SACE allow to machine glass and all material that contain silicon dioxyde. This technology preserves material while machining burrs- and cracks-free without leaving any deposits on the surface. Operations with aspect ratios of up to 1:10 can be realized.

                    Micro-holes with a depth of millimeters can be drilled in a few seconds and channels of several hundred microns deep can be produced without difficulty. It is also possible to cut glass over a thickness of a few millimeters. All these machining methods can be realized directly, without any intermediate process. And no post processes are necessary after machining.

                    Our objective is to increase the fundamental knowledge about material removal process with the aim to increase repeatability and precision of machining and develop strategies to functionalize glass during machining.

                    Why using this technology?
                    Glass micro-maching very often comes to its limits when requirements of no microcracks, no deposits and no burrs are necessary for post-processing e.g. like fusion bonding. Posalux SACE technology overcomes these issues. Our built-in patented “zero force” technology regulates vertical forces such that there is never a touch of workpiece and tool. SACE is a hybrid process, chemical and thermal, which does not influence the material structure while maching the required geometries. Various processes are possible like drilling, cutting, engraving, and structuring that are normally very difficult to machine.

                    Configuration of different types of holes that are possible to machine:
                    • cylindrical holes
                    • blind holes
                    • conical holes ( TGV)

                    Various examples of milling and engraving:
                    • free formed shapes
                    • height controlled structures ( pyramid)
                    • roughing or finishing
                      • FEMTO LASER μ-Machining

                      • FEMTO LASER μ-machining is the most advanced laser technology to process a wide range of materials. Thanks to very low heat diffusion time (< 300 fs), thermal effects are avoided. Surface and geometries quality is improved due to high energy density. High repetition rate allows excellent productivity.

                        Flexilibity
                        Drilling, cutting, turning

                        Function
                        With each FEMTO LASER pulse that hits the work-piece a small amount of material immediately vaporizes. The material removal occurs in a controlled manner leading to no damage, burrs or any negative influences to the material integrity.

                        Posalux FEMTO LASER μ-machining solutions benefits are :
                        • FEMTO source < 300 fs
                        • Highest level of accuracy and productivity
                        • Stable and repeatable quality
                        • Cold ablation keeping material integrity (NAZ)
                        • Proven performance in 24/7 industrial environment

                        Wide range of materials
                        • Ceramic
                        • Nitinol
                        • Titanium
                        • Polymers
                        • Precious materials
                        • Copper
                        • Steel, stainless steel
                        • Brass
                          • Drilling / Milling / Routing


                          • High-tech 2.5D micro machining solutions dedicated to mass production for electronics and watch markets.

                            Function
                            • Materials : aluminium, PCB, steel, hardened steel, brass, copper
                            • Depth controlled drilling and milling process
                            • Refered to top/bottom and inner layers

                            Applications
                            Dedicated to non-ferrous material in sheets and plates :

                            • FR4-based PCBs
                            • Metal backed PCBs
                            • Insulated Metal Substrate (IMS) PCBs

                            Specifications

                            • X, Y and Z axes with linear motor drives
                            • Controlled depth drilling and routing processes (blind holes, floating, mapping, polishing, etc.)
                            • Accuracy ±15 microns
                            • Axes acceleration up to 4g
                            • Diameter/depth ratio 1/10
                            • Up to 12 spindles per machine
                            • Up to 12’000 tools embedded
                            • Software with Posalux intuitive MMI
                            • Dual versions with two identical machining units are available

                            Benefits

                            • Designed for sheet and plate products
                            • Hole diameter down to 75 microns
                            • High productivity : up to 20 hits/sec/spindle
                            • Process stability : temperature management and axis positioning optimization
                            • Accuracy improved by alternating drilling and routing on the same machine