Siemens intensify their future collaboration in power electronics for the e-Car Business

• Siemens agrees closer cooperation with Semikron International GmbH
• Takeover of Semikron’s VePOINT automotive subsidiary
• Innovative e-Car inverter technology range broadened

The Siemens Drive Technologies Division has signed a cooperation agreement with Semikron International in order to intensify their future collaboration in power electronics for electric vehicles. Under the agreement Siemens has taken over the fully owned Semikron subsidiary VePOINT, which has 30 highly qualified employees based in Nuremberg. The two companies have agreed to keep the purchase price confidential.

VePOINT develops innovative power electronic components and systems, based on Semikron SKiN technology, specifically for the hybrid and electric vehicle market. These solutions complement the Siemens range of products by adding systems with attractive power densities and power/weight ratios for automobile applications. With the acquisition of VePOINT and the associated widening of its power electronics portfolio, Siemens Drive Technologies is pushing ahead with the further expansion of its Inside e-Car Business Unit. The cooperation agreement between Siemens and Semikron will also see a continuation of the existing close collaboration of the two companies in the field of innovative power modules.

Photo by Siemens AG

Jörg Grotendorst, CEO of the Siemens Inside e-Car Business Unit, said, “The cooperation with Semikron and the acquisition of VePOINT are important milestones for us on our way toward achieving a high degree of integration in the entire drive train. This widens the Siemens range of motors, inverters, speed sensors and gearboxes by adding further innovative e-Car power electronics.”

VePOINT has developed its own inverter platform which features a compact design, high power densities, an optional combination of inverter and DC/DC converter, high power/weight ratios and maximum reliability. These performance features are achieved thanks to the Semikron SKiN technology, which does not require conventional soldered joints or wire bonds.

for further information visit www.industry.siemens.com

• CID: 15285