ADLINK presents its new Express ADP Type 6 Basic size and Express-ID7 Type 7 Basic size modules

ADLINK Technology Inc., a global leader in edge computing and a chair of the PICMG® subcommittee, demonstrated PICMG’s latest COM.0 R3.1 with two new COM Express modules complying to the revision — ADLINK’s Express ADP Type 6 Basic size and Express-ID7 Type 7 Basic size.

Compared to R3.0, Revision 3.1 has added support for several advanced interfaces suitable for next-gen AIoT applications, such as PCIe Gen 4 support across all module types, USB4 for Type 6 and adding a second PCIe Clock while updating 10G Ethernet to support CEI side-band signaling for Type 7. Other enhancements include adding options for general purpose SPI, MIPI-CSI connectors, and SoundWire, as well as adding IPMB for Type 7.

R3.1 compliant, ADLINK’s Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size modules are respectively powered by 12th Gen Intel® Core™ and Intel® Xeon® D-1700 processors.

ADLINK Express-ADP Type 6 Basic size utilizes 12th Gen Intel® Core™ processors based on advanced hybrid architecture with up to 6 Performance-cores (P-cores) and 8 Efficient-cores (E-cores), effectively boosting productivity and fueling IoT innovation across a wide variety of deployments. It provides DDR5 memory support with up to 4800 MT/s combined with increased cache, and integrated Intel® Iris® Xe graphics with up to 96EUs, to offer four concurrent 4K60 HDR displays and Intel® Deep Learning Boost for superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, the module provides premium graphics features for superior content support, display and I/O virtualization.

ADLINK Express-ID7 Type 7 Basic size, based on Intel® Xeon® D-1700 processor, features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Built for rugged and edge AI applications, this ADLINK COM with Intel® Ice Lake-D empowers system integrators to realize all of their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.

For immediate application-specific development, ADLINK will also have out-of-the-box-ready development kits with the above mentioned COM.0 R3.1 modules. Developers can seek further details about these dev kits from ADLINK’s I-Pi wiki website. In addition, for convenient reference testing, ADLINK offers carrier boards — Express-BASE6 R3.1 and Express-BASE 7 R3.1 — and bundled starter kits, available on ADLINK’s website.

For more information, please visit http://www.adlinktech.com.